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High-Temperature Physical Properties Analyzer

Published: 8/19/2015

The SJY-II-14/17 is a high-temperature imaging analyzer for determining sintering point, refractoriness, dimensional change, and contact angle of sands, refractories, ceramics, and related materials. It supports programmable heating and image-based analysis for industrial QA, R&D, and education in foundry, ceramics, and glass sectors.

Product Description

The SJY-II-14/17 is a transmission-projection imaging system designed to observe and quantify material behavior under high temperature. It enables clear visualization of sample shrinkage, expansion, purification, and interface contact angle on a screen while recording the corresponding temperatures at which these events occur.

Typical applications include measuring sintering point and refractoriness of molding sands, refractories, and ceramic raw materials, as well as surface contact angles on metals. The instrument integrates computer control and image-processing software for image storage/printing, contact angle analysis, dimensional change analysis, and historical data review, serving production material selection and laboratory research needs.

Technical Specifications

ParameterSpecification
Maximum Heating Temperature1400 ℃ or 1700 ℃ (two configurations)
Furnace Chamber Diameter30 mm
Heating Rate0–10 ℃/min, programmable
Temperature ControlProgram control with intelligent PID; control accuracy ±1 ℃; ≥32 programmable segments
Imaging Magnification8–9×; coordinate overlay supports basic quantification of shrinkage/expansion
Image Capture Interval≥1 ℃ (configurable)
CameraCCD, ≥3 megapixels
Power Supply220 V ±10 %, 2.5 kW
Computer InterfaceStandard PC interface; tests controlled via computer
Software FunctionsImage storage, image printing, contact angle analysis, shrinkage/expansion data analysis, historical data query
Sample Size (Max)Φ6 × 8 mm, cylindrical; custom sizes available
Sintering Temperature Measurement MethodsVisual inspection and image-based shrinkage method
Refractoriness (Melting Temperature) CriterionTemperature at which the profile becomes round
Vacuum System−0.1 MPa or 1.0 × 10^-2 Pa; higher vacuum available on request

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