Insulation Hot Plate Thermal Conductivity Analyzer
Published: 9/25/2023
The DRX-II-300A thermal conductivity analyzer measures the thermal conductivity of insulation materials using a guarded hot plate method conforming to GB/T 10294-2008. It is widely used in construction material testing, research institutions, and quality control laboratories.
Product Description
The DRX-II-300A Insulation Hot Plate Thermal Conductivity Analyzer is designed to accurately measure the thermal conductivity of various solid materials, including insulation materials used in building engineering, glass, fibers, foams, and more. It caters to materials such as fiberboards, loose-filled glass fibers, ceramic fibers, various foam plastics, composite boards, vacuum panels, rubber products, cement products, powder materials, filler materials, and gypsum boards.
Complying with national standard GB/T 10294-2008, this instrument has been significantly upgraded from the previous DRX-I-PC model to include advanced features such as triple temperature protection, environmental heat interference minimization, automatic parallel adjustment of test specimens, and sophisticated electronic and software components for precise control and data handling. It is suitable for institutions involved in material performance testing, scientific research, factory quality inspection, and educational purposes in universities.
Technical Specifications
| Parameter | Specification |
|---|---|
| Thickness Measurement | Real-time online detection and reading |
| Specimen Pressure Control | Real-time detection, display, and control |
| Design | Double plate structure with high precision temperature compensation |
| Temperature Tracking | Fuzzy PID control for hot plate precision |
| Self-Calibration | Thermal conductivity and heating power calibration |
| Environmental Requirements | Temperature 18–25°C, Humidity 20–80% RH |
| Power Supply | AC 220V±5%, Power 3.0kW |
| Thermal Conductivity Range | 0.01–2.2 W/(m·K) |
| Measurement Repeatability | ±1.0% |
| Measurement Accuracy | ±2.5% |
| Temperature Range | Cold plate -20°C to 60°C, Hot plate RT to 110°C |
| Cooling Options | Electronic semiconductor, compressed air, cooling water, ethanol medium |
| Sample Size | 200×200×(5-20) mm, 300×300×(5-50) mm |
| Control Precision | Hot plate ±0.1°C, Cold plate ±0.1°C |
| Interface Software | Fully automatic heat analysis software with data analysis and report functions, Windows 10/7/XP |
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B6-101, Zhongnan High-Tech Intelligent Manufacturing Industrial Park, No. 10 Shuangma Street, Yuetang District, Xiangtan City, Hunan Province, China
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