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Automatic High-Precision Heat Flow Method Thermal Conductivity Tester

Published: 6/17/2025

The DRH-30S measures the thermal conductivity and thermal resistance of homogeneous, plate-like and compressible materials using the heat flow method. It supports rapid, accurate testing across low to high conductivity ranges for plastics, rubbers, foams, ceramics, rocks, refractories, composites, and insulation materials in R&D and quality control.

Product Description

DRH-30S is a heat flow method instrument designed for steady-state thermal property measurements of a wide variety of materials, including porous foams, plastics, rubber, glass, fibers, EPS/XPS boards, foamed concrete, hollow glass, ceramics, rocks and soils, refractories, polymers, nylon, resins, and insulation boards and coatings. The system places a specimen between a controlled hot plate and a cold plate, measures heat flux through a calibrated heat flux sensor, and calculates thermal conductivity and thermal resistance with automated pressure loading and thickness determination.

The instrument aligns with ASTM D5470 and ASTM C518 for heat transfer characterization, and conforms to GB 10295-2008 and GB/T 25261-2018 requirements for reflective insulation coatings. It can operate as a standalone unit or under PC control, delivering fast, repeatable results suitable for materials testing institutes, research organizations, factory QC labs, and university teaching and research.

Technical Specifications

ParameterSpecification
Measurement MethodHeat flow meter (steady-state)
Standards ComplianceASTM D5470; ASTM C518; GB 10295-2008; GB/T 25261-2018 (App. A)
Thermal Conductivity Range (Low)0.0150–5 W/(m·K)
Thermal Conductivity Range (High)3–500 W/(m·K)
Data Resolution4 decimal places
Accuracy (Heat Flux Sensor)±2%
Accuracy (Test Result)±3%
Repeatability±2%
Cold Plate Temperature Range0–70 ℃
Cold Plate Temperature Resolution0.01 ℃
Cold Plate ConditioningHigh-precision low-temperature constant-temperature bath
Hot Plate Temperature RangeAmbient +5 ℃ to 350 ℃
Hot Plate Temperature Resolution0.01 ℃
Hot Plate Temperature Stability0.02 ℃
Hot Plate ControlBidirectional SCR control
Low-Temperature Bath ControlProgrammable via host PC (custom configuration)
Heat Flux Sensor SensitivityBetter than 0.47 μV·W/m²
Heat Flux Range50–3000 W/m²
Specimen Size (Round)φ60 × (1–40) mm
Specimen Size (Square)50 × 50 × (1–40) mm
Thickness Measurement RangeUp to 50 mm
Thickness Resolution1 μm
Load/Pressure Control RangeUp to 500 N
Load Resolution0.1 N
Loading MechanismStepper motor + stepper controller
Automation FeaturesAutomatic loading/unloading; automatic thickness measurement; testing under variable pressure
SoftwareAutomated thermal analysis software; Chinese/English UI
Operating Temperature (Environment)−5–40 ℃
Relative Humidity0–95%
Power SupplyAC 220 V, 50 Hz
Typical ConfigurationTest mainframe (1 set); constant-temperature bath (1 set); analysis software (1 set); PC (1 set)

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